Productintroduction：
Leetop_ALP_681_F is an embedded artificial intelligencecomputer developed based on the NVIDIA AGX Orin core boardwhich can provide computing power up to 200/275TOPS formany terminal devices. Leetop_ALP_681_F provides a fast activecooling design, which can meet industrial standards such asshock resistance and anti-static.At the same time.Leetop_ALP_681_F has rich interfaces and high cost performance.
product specification
processor module
| specifications | ||
| Module | Nvidia Jetson AGX Orin 32GB | Nvidia Jetson AGX Orin 64GB |
| AI Performance | 200 TOPS | 275 TOPS |
| CPU | 1792-core NVIDIA Ampere GPU with 56 Tensor Cores | 2048-core NVIDIA Ampere GPU with 64 Tensor Cores |
| GPU | 8-core NVIDIA Arm® Cortex A78AE v8.2 64- bit CPU 2MB L2 + 4MB L3 | 12-core NVIDIA Arm® Cortex A78AE v8.2 64- bit CPU 3MB L2 + 6MB L3 |
| Memory | 32 GB 256-bit LPDDR5 204.8 GB/s | 64GB 256-bit LPDDR5 204.8 GB/s |
| Storage | 64GB eMMC 5.1 | |
| Video Encode | 1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | 2x 4K60 4x 4K30 8x 1080p60 16x 1080p30 (H.265) 2x 4K60 4x 4K30 7x 1080p60 15x 1080p30 (H.264) |
| Video Decode | 1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | 1x 8K30 3x 4K60 6x 4K30 12x 1080p60 24x 1080p30 (H.265) 1x 4K60 3x 4K30 7x 1080p60 14x 1080p30 (H.264) |
| Power | 15W - 40W | 15W - 60W |
I/O
| interface | Specifications |
| DC | Power supply interface |
| Display | 1 x HDMI |
| USB | 4x USB 3.0 Type A (Integrated USB 2.0) 1x USB 2.0+ 3.0 (TYPE C) |
| Network | 1x Gigabit Ethernet (10/100/1000) 1xGigabit Ethernet (10G) |
| SIM_Card | 1xSIM_Card |
| GMSL | 2xGMSL |
| TF_Card | 1xTF_Card |
| Function key | 1xPower ;1xRESET ;1xRecovery |
Power Supply
| Power Supply | Spec |
| Input Voltage | +12(16A)---+36V(140W) DC Input |
| Power consumption | 90W |
Mechanical
| Mechanical | Spec |
| Dimensions (W×D ×H) | 224X175X65.4(mm) |
| Weight | 2.8KG |
Environmental
| Environmental | Spec |
| Operating Temperature | -20℃-70℃ 0.2~0.3m/s Turbulence |
| Storage Temperature | -20℃-60℃ |
| Storage Humidity | 10%-90% non-condensing |
Schematic diagram of dimensions
| Front view | Left view |
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| Up view | Rear view |
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Matching table
| Product name | Core module | SSD | communication | power |
| ALP_681_F | ||||
| J1:AGX Orin(32G) | ||||
| J2:AGX Orin(64G) | ||||
| N | ||||
| 128G | ||||
| 256G | ||||
| 512G | ||||
| 1T | ||||
| N | ||||
| 4G | ||||
| 5G | ||||
| N | ||||
| 01:Ming Wai | ||||
| 02:Customisation |
